Sensor package and method
US7021147B1 · kind B1 · utility
45Cited by
6References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 11, 2005 |
| Grant date | Apr 4, 2006 |
| Priority date | — |
| Expiry date | Jul 11, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L19/0645
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A sensor package and method are described. The sensor package includes an enclosure, a diaphragm coupled to the enclosure. The diaphragm is configured to receive vibrations from an ambient environment. Further, the sensor package includes a pressure sensing element disposed inside the enclosure, and a pressure transfer medium disposed inside the enclosure and proximate the pressure sensing element, where the pressure transfer medium includes a fluid, and a plurality of filler particles suspended in the fluid. The filler particles serve to reduce a coefficient of thermal expansion of the pressure transfer medium.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.