Component to heat sink spring clip method and apparatus
US7021365B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 15, 2002 |
| Grant date | Apr 4, 2006 |
| Priority date | — |
| Expiry date | Oct 25, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is a spring clip apparatus for holding one or more heat generating components, such as field effect transistors (FETs) and diodes, firmly against a heat receiving side of a finned heat radiating device having slots within or between the fins. In a finned heat sink, a moving arm of the clip slides into and makes contact with the heat sink in the slot and the confines of the slot prevent further sideways movement while another arm contact point of the clip holds the component firmly in position against the heat sink opposite the moving arm contact point. Clips may be both single and dual arm and may be configured for holding from one to multiple components in contact with the heat sink. The clip may also be used in a similar manner with a non-finned heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.