Bonding methods for microchannel plates
US7021522B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 24, 2005 |
| Grant date | Apr 4, 2006 |
| Priority date | — |
| Expiry date | Jan 24, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2231/5016
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Mating faces of a microchannel plate (MCP) (50) and a multi-layer ceramic body (80) unit are deposited with a thin film having protuberances (84) using a suitable metal selected for optimum diffusion at a desired temperatures and pressure. The metallized MCP (50) and multi-layer ceramic body (80) unit are then aligned and placed in a bonding fixture (F) that provides the necessary force applied to the components to initiate a diffusion bond at a desired elevated temperature. The bonding fixture (F) is then placed in a vacuum heat chamber (V) to accelerate the diffusion bonding process between the MCP (50) and the multi-layer ceramic body unit (80).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.