Injection compression molding apparatus and injection compression molding method
US7021924B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 4, 2003 |
| Grant date | Apr 4, 2006 |
| Priority date | — |
| Expiry date | Jan 29, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C45/561
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
In an injection compression molding apparatus and an injection compression method according to the present invention, the structure of the dies can be simplified and a loss of resin as well as of heat due to solidification of the resin in the path at the time of molding can be eliminated. Further, injection pressure loss can be reduced when melted resin is injected into a cavity. A resin injection hole in a nozzle that is attached to an injection device is connected at a position between a stationary die and a movable die directly to the cavity that has a larger volume than a volume of a molded product by means of the movable die, melted resin is injected into said cavity directly from said resin injection hole by said injection device, then the movable die is moved, in the die closing direction, to reduce the distance of the connection between said resin injection hole and said cavity by means of a side wall of the movable die, and to reduce the volume of the cavity so as to compress said melted resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.