Flexible land grid array connector
US7021941B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 19, 2004 |
| Grant date | Apr 4, 2006 |
| Priority date | — |
| Expiry date | Oct 19, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10378
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An LGA connector is used to interconnect an LGA package and a printed circuit board. The LGA connector includes an elastomeric body with a plurality of through-holes. Metal films are formed on inner walls of through-holes and splay out around the mouths of their upper and lower openings. The metal films are formed by vacuum metallization, sputtering, chemical plating, electrical plating or PVD. The through-holes have a funnel-like shape to absorb external stresses and redirect the stress to shrink the through-hole diameters. Moreover, the metal films' elastic deformation is larger than conventional metal conductive fillers so as to improve reliability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.