Chemical-mechanical planarization composition with nitrogen containing polymer and method for use
US7022255B2 · kind B2 · utility
18Cited by
9References
16Claims
0Family size
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Key dates
| Filing date | Oct 10, 2003 |
| Grant date | Apr 4, 2006 |
| Priority date | — |
| Expiry date | Jul 2, 2024 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K3/1463
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A composition and associated method for chemical mechanical planarization (or other polishing) are described. The composition comprises an organometallic-modified colloidal abrasive and a nitrogen-containing polymer compound (e.g., a polyalkyleneimine, such as polyamidopolyethyleneimine). The composition possesses both high stability towards gelling and/or solids formation and high selectivity for metal removal in metal CMP. The composition may further comprise an oxidizing agent in which case the composition is particularly useful in conjunction with the associated method for metal CMP applications (e.g., copper CMP).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.