Method for producing porous polyimide resin and porous polymide resin
US7022377B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 10, 2002 |
| Grant date | Apr 4, 2006 |
| Priority date | — |
| Expiry date | Nov 17, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0773
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of producing porous polyimide resin that enables pores to be formed in a precursor of polyimide resin, with its form of microphase-separated structure wherein a dispersive compound is dispersed in the precursor of polyimide resin being kept unchanged, so as to provide significantly reduced dielectric constant and also provide improvement in mechanical strength and heat resistance, and the porous polyimide resin produced in the same producing method. A coating comprising porous polyimide resin is formed by applying resin solution comprising a precursor of polyimide resin and a dispersive compound and then drying a solvent, to form a coating in which the dispersive compound is dispersed in the precursor of polyimide resin; extracting the dispersive compound from the coating for removal to make the precursor of the polyimide resin porous; and imidizing the coating after preheated in a temperature range of 190–250° C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.