Combinations of resin compositions and methods of use thereof
US7022410B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 16, 2003 |
| Grant date | Apr 4, 2006 |
| Priority date | — |
| Expiry date | Jun 22, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31515
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A composition for use as underfill material is provided. The underfill material includes a first curable transparent resin composition and a second curable fluxing resin composition. The first curable resin composition includes at least one aromatic epoxy resin in combination with a solvent, a functionalized colloidal silica dispersion, and at least one other component selected from the group consisting of cycloaliphatic epoxy monomers, aliphatic epoxy monomers, hydroxy aromatic compounds and combinations and mixtures thereof, thereby forming a solvent-modified resin. The second curable fluxing composition includes at least one epoxy resin. The combination of the two resin compositions is useful in producing underfill materials and is suitable for use as an encapsulant for electronic chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.