Exposure device, exposure method and method of manufacturing semiconductor device
US7022556B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 10, 1999 |
| Grant date | Apr 4, 2006 |
| Priority date | — |
| Expiry date | Nov 10, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG09G3/3208
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention provides a highly controllable device for exposure from the back side and an exposure method, and also provides a method of manufacturing a semiconductor device using the same. The present invention involves exposure with the use of the back side exposure device of which a reflecting means is disposed on the front side of a substrate, apart from a photosensitive thin film surface by a distance X(X=0.1 μm to 1000 μm), and formation of a photosensitive thin film pattern in a self alignment manner, with good controllability, at a position a distance Y away from the end of a pattern. The invention fabricates a TFT using that method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.