Method for engraving materials using laser etched V-grooves
US7023001B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2003 |
| Grant date | Apr 4, 2006 |
| Priority date | — |
| Expiry date | Mar 31, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Disclosed is a method for engraving materials such as fused silica or ceramic by continuously actuating a laser producing a Gaussian beam, directing the beam towards the surface of the substrate and moving the beam relative to the surface of the substrate so that a V-groove is obtained by laser ablation of the substrate. The depth of the groove, the angle of the top of the groove, can be controlled by the relative speed between the laser beam and the substrate, the power density and the width of the laser beam, the polarization of the laser beam and the incident angle of the laser beam with respect to the surface. A method for treating an optical fiber connector is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.