Optical interconnects in integrated circuits
US7023023B2 · kind B2 · utility
5Cited by
3References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 30, 2003 |
| Grant date | Apr 4, 2006 |
| Priority date | — |
| Expiry date | Nov 22, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/02325
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An integrated circuit die includes optical interconnect ports on a first side and electrical interconnect ports on a second side.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.