Integrated circuit carrier and method of manufacturing and integrated circuit
US7023087B1 · kind B1 · utility
0Cited by
10References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 21, 1998 |
| Grant date | Apr 4, 2006 |
| Priority date | — |
| Expiry date | Aug 21, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/0084
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for manufacturing an integrated circuit including the steps of providing a chip carrier including a base, an inner well formed about the periphery of the base, and an outer well formed about the periphery of the inner well. An integrated circuit is positioned on the base. The process further includes the steps of pre or post processing the integrated circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.