Carrier
US7023095B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 20, 2004 |
| Grant date | Apr 4, 2006 |
| Priority date | — |
| Expiry date | Sep 25, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A carrier is provided. The carrier is bonded with a substrate having a number of contact pads through an anisotropic conductive film by thermocompression. The carrier includes a base and a number of leads, wherein the base has a base's surface on which a number of indented patterns are disposed. The leads are disposed on the base's surface with their one end, which are electrically connected to the contact pads through the anisotropic conductive film, being alternately arranged with the indented patterns; meanwhile, part of the anisotropic conductive film spread into the indented patterns when the carrier is bonded to the substrate by thermocompression.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.