Integrated cooling duct for resin-encapsulated distribution transformer coils
US7023312B1 · kind B1 · utility
23Cited by
23References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2001 |
| Grant date | Apr 4, 2006 |
| Priority date | — |
| Expiry date | Nov 9, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49224
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A dry-type, resin-encapsulated transformer coil that includes multiple layers formed from a length of conductive material, and multiple cooling ducts that are formed of thermoplastic material and spaced between the layers of conductive material. The thermoplastic material forming the cooling ducts and the resin that encapsulates the multiple layers of conductive material are thermally and electrically compatible.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.