Apparatus including circuit board and heat sink and method of making the apparatus
US7023702B2 · kind B2 · utility
1Cited by
6References
23Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 9, 2003 |
| Grant date | Apr 4, 2006 |
| Priority date | — |
| Expiry date | Aug 16, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In some embodiments, an apparatus includes a circuit board, a plurality of metal inserts, and a heat sink having a plurality of mounting holes. Each of the metal inserts may include at least one lower member soldered to the circuit board, and an upper portion received in a respective one of the mounting holes of the heat sink and secured to the respective one of the mounting holes by a respective fastener.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.