Method for assessing fit and alignment of a manufactured part
US7024032B2 · kind B2 · utility
86Cited by
8References
10Claims
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Key dates
| Filing date | Oct 30, 2003 |
| Grant date | Apr 4, 2006 |
| Priority date | — |
| Expiry date | Nov 26, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30164
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An automated method is provided for assessing fit and alignment of an assembly component in relation to its assembly environment. The method includes: collecting measurement data for the assembly component; defining model data representative of an assembly environment, where the assembly environment is defined by surfaces of objects that are adjacent to the assembly component in an assembled configuration; and comparing the measurement data with the model data for the assembly environment, thereby assessing the assembly component in relation to its assembly environment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.