Heat dissipating device with heat pipe
US7025125B2 · kind B2 · utility
15Cited by
7References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 15, 2004 |
| Grant date | Apr 11, 2006 |
| Priority date | — |
| Expiry date | Oct 2, 2024 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F1/32
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat dissipating device incorporating heat pipes is disclosed. The heat dissipating device includes a base (10), a plurality of heat-dissipating fins (30) and at least one heat pipe (20). The base defines at least a groove (13) thereon. The heat pipe comprises an evaporating portion (22) received in the groove and a condensing portion (21) extending through the fins. The evaporating portion of the heat pipe is curved so as to increase contact surface between the evaporating portion and the base. The condensing portion of the heat pipe extends perpendicularly away from the base.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.