Bondhead for wire bonding apparatus
US7025243B2 · kind B2 · utility
4Cited by
9References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 16, 2004 |
| Grant date | Apr 11, 2006 |
| Priority date | — |
| Expiry date | Jun 16, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01082
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bondhead is provided that comprises a bondhead body for holding a bonding tool, such as an ultrasonic transducer, and a bondhead actuator coupled to the bondhead body for moving the bonding tool with respect to a bonding surface. A wire clamping device, which may comprise a wire clamp holder and a wire clamp, is movable relative to the bondhead body for feeding a bonding wire to the bonding tool. A wire clamping device actuator is operative to move the wire clamping device relative to the bondhead body for improved control of the feeding of bonding wire to the bonding tool.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.