Patent · US Expired

Sockets for microassembly

US7025619B2 · kind B2 · utility

35Cited by
70References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 8, 2005
Grant dateApr 11, 2006
Priority date
Expiry dateMar 8, 2025

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB81B2201/13
  • WIPO fieldMicro-structural and nano-technology
  • WIPO sectorChemistry

Abstract

An apparatus including at least three deflectable members each configured to deflect during assembly with a component, and also configured to remain in contact with the component after assembly with the component. At least one of the deflectable members and the component has a thickness not greater than about 1000 microns.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.