Method and apparatus for cutting ultra thin silicon wafers
US7025665B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 24, 2005 |
| Grant date | Apr 11, 2006 |
| Priority date | — |
| Expiry date | Mar 24, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB28D5/0082
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A wire saw and wafer stabilizing system are provided for holding wafer sections invariantly against vibration and unwanted movement during the sawing process. A stabilizing means is applied to the ends of partially defined wafer sections at an early stage when the wafer sections are partially cut through a silicon ingot or block of silicon material. The stabilizing means serves to stabilize the wafer sections immovably against vibration, oscillation, or unwanted contact during the subsequent sawing process. The stabilizing system also accelerates handling of the wafers after slicing is completed, facilitates the cleaning process, and allows for more rapid or automated placement of the wafers in cassettes. Wafers produced by the stabilizing system are characterized by a minimized total thickness variation, substantially uniform planarity, and substantially without bow or warp.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.