Method of attaching optical waveguide component to printed circuit board
US7025849B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 16, 2003 |
| Grant date | Apr 11, 2006 |
| Priority date | — |
| Expiry date | Dec 10, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1309
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Disclosed is a method of attaching an optical waveguide component to a printed circuit board, which is a double-sided or a multilayer printed circuit board, through pre-bonding and main-bonding by use of an adhesive tape. Prior to being attached to the printed circuit board, the optical waveguide component is preferably subjected to a plasma surface treatment to give a surface roughness thereto. The present method is advantageous in that the optical waveguide component can be attached to the printed circuit board with improved flatness and precise alignment without causing chemical or thermal damage to the optical waveguide component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.