Processing materials inside an atmospheric-pressure radiofrequency nonthermal plasma discharge

US7025856B2 · kind B2 · utility

Assignee

• The Regents of the University of California · US

Inventors

• Gary S. Selwyn · Hopewell Junction, US
• Ivars Henins · Los Alamos, US
• Jaeyoung Park · Los Alamos, US
• Hans Herrmann · Los Alamos, US

Key dates

• Filing date: Feb 2, 2001
• Grant date: Apr 11, 2006
• Expiry date: Feb 2, 2021

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/31
• WIPO field: Electrical machinery, apparatus, energy
• WIPO sector: Electrical engineering

Abstract

Apparatus for the processing of materials involving placing a material either placed between an radio-frequency electrode and a ground electrode, or which is itself one of the electrodes. This is done in atmospheric pressure conditions. The apparatus effectively etches or cleans substrates, such as silicon wafers, or provides cleaning of spools and drums, and uses a gas containing an inert gas and a chemically reactive gas.