Method and apparatus for forming a metallic feature on a substrate
US7026012B2 · kind B2 · utility
5Cited by
1References
63Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 22, 2002 |
| Grant date | Apr 11, 2006 |
| Priority date | — |
| Expiry date | Apr 25, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/821
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of forming a metallic feature on a substrate, comprising the steps of: providing a stamp having a raised region; depositing catalytic particles on a selected area of the stamp, including the raised region thereof; providing a substrate; applying the stamp to the substrate, such that the raised region of the stamp causes a corresponding indented region in the substrate and at least some of the catalytic particles are transferred to a selected area of the substrate; and plating the selected area of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.