Method for producing polymer-free area on a substrate
US7026186B2 · kind B2 · utility
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25Claims
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Assignee
Inventor
Key dates
| Filing date | Jun 17, 2002 |
| Grant date | Apr 11, 2006 |
| Priority date | — |
| Expiry date | Oct 9, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K50/844
Abstract
The invention relates to a method for producing a polymer-free area, characterized by applying at least one peelable layer to the substrate, and/or to one or more polymer layer(s) situated on the substrate, in those areas where a polymer-free area is formed on the substrate by removing the peelable layer. The invention thus provides a method for producing polymer-free bonding areas or, by placing a diode-protecting cap on the polymer-free area of the substrate, a hermetically sealed connection between the substrate and the diode-protecting cap.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.