Method of optimized stitching for digital micro-mirror device
US7026251B2 · kind B2 · utility
0Cited by
3References
10Claims
0Family size
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Key dates
| Filing date | Dec 12, 2002 |
| Grant date | Apr 11, 2006 |
| Priority date | — |
| Expiry date | Oct 10, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70475
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method of providing a reticle layout for a die having at least three patterns, namely a right pattern, a center pattern, and a left pattern, where the center pattern is oversized relative to the photolithography step size. To avoid the non-uniformity effects resulting from stitching the center pattern, the center pattern size is minimized. This is accomplished by moving portions of the center pattern to the left and right patterns.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.