Thermal dispensing enhancement for high performance flip chip BGA (HPFCBGA)
US7026711B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 16, 2003 |
| Grant date | Apr 11, 2006 |
| Priority date | — |
| Expiry date | Dec 16, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16195
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A microelectronic package comprising a device substrate having first and second opposing surfaces and comprising a plurality of microelectronic devices. The microelectronic package also includes a plurality of electrically conductive members coupled to corresponding ones of the plurality of microelectronics device and extending away from the first surface. A thermally conductive layer is located on the second surface of the device substrate, and a package substrate is coupled to the device substrate, the package substrate having a plurality of electrically conductive traces coupled to corresponding ones of the plurality of electrically conductive members.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.