Flip-chip mounted integrated circuit card element
US7026720B2 · kind B2 · utility
1Cited by
4References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2000 |
| Grant date | Apr 11, 2006 |
| Priority date | — |
| Expiry date | Mar 20, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The invention relates to an integrated circuit card element, comprising a support (1) on which an electrical circuit (2) is produced, an integrated circuit (5) being connected thereto and having an active flip-chip mounted surface (7), said integrated circuit (5) being fixed to the support by a sealing product (6) that is arranged between the active surface of the integrated circuit and the support. The inventive element comprises a reinforcement segment (8) which is fixed on an inactive surface (9) of the integrated circuit opposite the active surface (7).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.