Compact electronics plenum
US7027300B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 16, 2003 |
| Grant date | Apr 11, 2006 |
| Priority date | — |
| Expiry date | Jun 8, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A plenum (12, 60) having a plurality of heat fins (40, 72) and also a receptacle (20) for receiving a heat generating component (22) in a friction fit arrangement. The plenum has a plurality of passageways (14, 66) defined by the plurality of fins arranged in rows, and also includes a plurality of openings (50, 76) disposed between the fin. The receptacle frictionally receives a respective heat generating component (22), and wicks heat to the fins. Air communicating through the passageways defined by the fins removes heat from the fins, and also creates a venturi effect to remove heat from within a housing via the openings to further cool the portable electronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.