Arrangement for surface mounting of subassemblies on a mother board
US7027305B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 18, 2003 |
| Grant date | Apr 11, 2006 |
| Priority date | — |
| Expiry date | Dec 25, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R43/0263
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The invention provides arrangements to facilitate surface mounting of subassembly boards on a motherboard with reliable, high conductivity interconnection. In accordance with the invention, the subassembly interconnection arrangement is composed of separate power and sense connector arms formed on one or more base headers. The arrangement interconnects and supports the subassembly board on the motherboard surface. Each power arm advantageously comprises a plurality of split-based mounting lugs secured to the arm in a coplanar configuration. Each sense connector arm preferably comprises a plurality of connector pins secured to the arm in a coplanar configuration. Embodiments are disclosed for vertical and horizontal surface mounting.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.