Microneedle array systems
US7027478B2 · kind B2 · utility
114Cited by
72References
22Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 20, 2001 |
| Grant date | Apr 11, 2006 |
| Priority date | — |
| Expiry date | Jun 8, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/3885
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention relates to systems of microneedle arrays to align and form optical components. Active components such as lasers are combined with optical fibers. Microneedles are fabricated using techniques such as laser drilled Kapton, and combined with optical fiber, using bump bonding and UV curing adhesives to manufacture a variety of optical components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.