Heat dissipating device with heat pipe
US7028758B2 · kind B2 · utility
23Cited by
8References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2004 |
| Grant date | Apr 18, 2006 |
| Priority date | — |
| Expiry date | Dec 21, 2024 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28D15/0275
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat dissipating device incorporating heat pipes is disclosed. The heat dissipating device includes a base, a plurality of heat-dissipating fins and at least one heat pipe. The heat pipe includes an evaporating portion attached to the base, a middle-portion and a condensing portion extending through the fins. Bottoms of the evaporating portion of the heat pipe and the base are coplanar, and the condensing portion extends opposite to the evaporating portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.