Molding apparatus having a film heater
US7029260B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 14, 2005 |
| Grant date | Apr 18, 2006 |
| Priority date | — |
| Expiry date | Feb 6, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2067/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Film heater apparatus and method for heating a melt channel in a molding device includes structure and/or steps whereby a first dielectric layer is disposed on a surface of a substrate. An active heating element is disposed on the first dielectric layer, the active heating element being configured to generate heat to heat the melt channel. The active heating element has contact terminals arranged to support an electrical connection to the active heating element. A second dielectric layer is disposed over the active heating element, but not covering the contact terminals, thereby permitting coupling of the heater element to an electrical supply.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.