Wafer holding plate for wafer grinding apparatus and method for manufacturing the same
US7029379B2 · kind B2 · utility
0Cited by
8References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 6, 2005 |
| Grant date | Apr 18, 2006 |
| Priority date | — |
| Expiry date | Jul 6, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24C3/322
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for manufacturing a wafer holding plate for a wafer grinding apparatus wherein the plate includes a substrate having a wafer adhering surface to which a semiconductor wafer is adhered by an adhesive. The wafer adhering surface includes a mirror-like surface portion and a groove pattern, which anchors the adhesive. When the plate is used for grinding wafers, the quality and accuracy of the finished wafers is greatly improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.