Single wafer type substrate cleaning method and apparatus
US7029538B2 · kind B2 · utility
3Cited by
4References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 29, 2001 |
| Grant date | Apr 18, 2006 |
| Priority date | — |
| Expiry date | May 3, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In the drying step of the single wafer type substrate cleaning system for cleaning wafers not stored in a cassette, in a sealed cleaning housing, a spin drying treatment is applied to the wafer when the wafer is supported and rotated at high speed while an inert gas for preventing oxidation is supplied to the face of the wafer, and the amount of the inert gas to be supplied to the face of the wafer is larger at the outer peripheral portion of the wafer than that supplied at the center thereof, thereby preventing oxidation on the face of the wafer effectively while optimizing the benefits of the single wafer type cleaning system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.