Method of producing optical element forming die
US7029565B2 · kind B2 · utility
0Cited by
6References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 15, 2003 |
| Grant date | Apr 18, 2006 |
| Priority date | — |
| Expiry date | Apr 21, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29D11/00432
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method of producing a die for forming an optical element including; a positioning step to fix temporarily under the state wherein a plurality of members at least one of which has a die transfer surface are positioned with their connection surfaces being put to face each other, and an electroforming connection step to connect both members by forming an electroforming mold on a circumference of the connection surface under the state where the plural members are positioned.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.