Plated material and method of manufacturing the same, terminal member for connector, and connector
US7029760B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 10, 2003 |
| Grant date | Apr 18, 2006 |
| Priority date | — |
| Expiry date | Apr 21, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12993
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A plated material reduces insertion and withdrawal forces when used in a connector. A terminal member for a connector and a connector therewith are also provided. The plated material comprises a substrate 3 made of Cu or a Cu alloy and a metal plating layer 6 formed on the surface of the substrate 3. A soft region 6A spreading in a network-shape and a hard region 6B surrounded by the network of the soft region 6A coexists in the metal plating layer 6. The soft region 6A has a Vickers hardness of 20 to 250, while the hard region 6B has a Vickers hardness of 60 to 700, which is at least 30 higher than that of the soft region 6A. An average size of the network of the soft region 6A is from 5 to 500 μm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.