Ultrasonic agitation-assisted development of resist layer of master stamper/imprinter
US7029798B1 · kind B1 · utility
1Cited by
10References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 25, 2003 |
| Grant date | Apr 18, 2006 |
| Priority date | — |
| Expiry date | Jan 19, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/146
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of forming a topographical pattern in a surface of a resist layer, comprising sequential steps of:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.