Device and system for recording the motion of a wafer and a method therefrom
US7029930B2 · kind B2 · utility
8Cited by
3References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2002 |
| Grant date | Apr 18, 2006 |
| Priority date | — |
| Expiry date | Dec 4, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/26
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention provides a device that can be used to record the motion of a wafer and fine perturbations and vibrations in its motion during its progress through and between semiconductor process and inspection machines in the course of the actual manufacturing process or during a test cycle of the processing or inspection machine. It also provides a system and a method which uses this record mechanical malfunction of the processing or inspection machine which has caused, or could cause, defects in the manufactured wafer whether directly or indirectly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.