Method of assembling elements by localized heating
US7029990B2 · kind B2 · utility
0Cited by
5References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 28, 2002 |
| Grant date | Apr 18, 2006 |
| Priority date | — |
| Expiry date | Feb 28, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention relates to a process of assembly of at least two silicon substrates. The method comprises: The invention is applied to the sealing of cavities and of mechanical or electrical joints situated at the interface of two silicon substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.