Photosensitive resin composition, dry film, and workpiece using the same
US7030170B2 · kind B2 · utility
5Cited by
2References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 22, 2002 |
| Grant date | Apr 18, 2006 |
| Priority date | — |
| Expiry date | Mar 21, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photosensitive resin composition which contains (A) polyamic acid, (B) (meth)acrylate having at least two photopolymerizable C═C unsaturated double bonds, (C) a photopolymerization initiator and (D) a flame retardant, with the (meth)acrylate (B) having at least two photopolymerizable C═C unsaturated double bonds being contained in an amount of 10 to 700 parts by weight based on 100 parts by weight of the polyamic acid (A).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.