Package structure for light emitting diode and method thereof

US7030423B2 · kind B2 · utility

Assignee

• Epistar Corporation · TW

Inventors

• Chih-Sung Chang · Taichung, TW
• Tzer-Perng Chen · Hsinchu, TW
• Pai-Hsiang Wang · New Taipei, TW

Key dates

• Filing date: Nov 19, 2003
• Grant date: Apr 18, 2006
• Expiry date: Dec 9, 2023

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/8585

Abstract

A package structure for a light emitting diode (LED) includes a substrate structure and a reflective layer. The substrate structure sequentially includes a conduction board, an insulation layer, and a conductive layer. The substrate structure has an opening to expose the conduction board. The reflective layer configured to support and electrically couple to a first electrode of the LED is disposed in the opening. The reflective layer is electrically coupled to the conduction board and electrically insulated from at least a portion of the conductivity layer, which is coupled to a second electrode of the LED.