Integrated circuit device having flexible leadframe
US7030472B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 1, 2004 |
| Grant date | Apr 18, 2006 |
| Priority date | — |
| Expiry date | Apr 5, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit device having a flexible leadframe, and techniques for fabricating the flexible leadframe and integrated circuit device, are provided. In one aspect of the invention, an integrated circuit device comprises a heat spreader having a top surface and a bottom surface. At least one integrated circuit die is attached to the top surface of the heat spreader. A flexible leadframe is also attached to the top surface of the heat spreader. The flexible leadframe has one or more flexible layers, including at least one flexible insulating layer. A plurality of electrically conductive traces are defined on the at least one flexible insulating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.