Thermal interface structure with integrated liquid cooling and methods
US7030485B2 · kind B2 · utility
14Cited by
10References
9Claims
0Family size
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Key dates
| Filing date | Jun 26, 2003 |
| Grant date | Apr 18, 2006 |
| Priority date | — |
| Expiry date | Jun 26, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01327
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and device for thermal conduction is provided. A thermal interface device and method of formation is described that includes advantages such as improved interfacial strength, and improved interfacial contact. Embodiments of thermal conduction structures are shown that provide composite thermal conduction and circulated liquid cooling. Embodiments are further shown that require simple, low numbers of manufacturing steps and reduced thermal interface thickness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.