Heat pipe cooled electronics enclosure
US7031158B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 29, 2003 |
| Grant date | Apr 18, 2006 |
| Priority date | — |
| Expiry date | Sep 5, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20336
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An enclosure for electronic components is provided. The enclosure includes an electronics housing that has at least one slot for receiving one or more electronic components. The slot is defined by a plurality of walls. A heat pipe thermal management system is associated with the slot. The heat pipe system includes a heat pipe having a first portion embedded into one of the walls defining the slot for conducting heat from the wall to a second portion of the heat pipe extending out of the electronics housing. At least one cooling fin is carried by the second portion of the heat pipe such that heat from the heat pipe is conducted into the fin and the fin dissipates the heat to the ambient atmosphere outside of the electronics housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.