Method for mounting integrated circuits on a printed circuit card
US7032305B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 27, 2003 |
| Grant date | Apr 25, 2006 |
| Priority date | — |
| Expiry date | Oct 27, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49133
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of mounting electrical component assemblies on opposite sides of a printed circuit card including inserting a chock on a first side of the printed circuit card; inserting a standoff and placing a spring around each standoff; pressing the chock against the printed circuit card; mounting a first electrical component assembly on a second side of the printed circuit card; placing a package tool having a plurality of springs on a horizontal support so that when the first mounted electrical component assembly is placed inside the package tool the springs of the package tool come into contact with the first electrical component assembly; removing the chock from the printed circuit card such that the springs of the package tool compensate for the weight of the first electrical component assembly inside the package tool; and mounting a second electrical component assembly on the first side of the printed circuit card.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.