Method of molding low melting point metal alloy
US7032640B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 25, 2005 |
| Grant date | Apr 25, 2006 |
| Priority date | — |
| Expiry date | Feb 25, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S164/90
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method of molding a low melting point metal alloy which exhibits thixotropy properties at a solid-liquid coexisting temperature, said method comprising the steps of heating said metal alloy at a temperature in the solid-liquid coexisting temperature region to form a semisolid, supplying said semisolid to a heating/holding cylinder to be accumulated, and injecting said semisolid into a mold. At the end of the molding process, a remaining semisolid material is heated to a wholly molten state, then discharged by injection, and heating is stopped so that the molding operation is finished; or, at a temporary suspension of molding, an accumulated material is heated to a wholly molten state and, at the resumption of molding, the temperature of the heating holding cylinder is lowered to the original solid-liquid coexisting temperature region while discharging said wholly molten material by injection and resupplying with new semisolid molding material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.