Patent · US Expired

Signal conditioned modular jack assembly with improved shielding

US7033210B1 · kind B1 · utility

42Cited by
9References
30Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 27, 2004
Grant dateApr 25, 2006
Priority date
Expiry dateDec 27, 2024

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01R24/64
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

A stacked jack modular jack assembly is comprised of a multi-port housing, and a plurality of modular jack subassemblies. The jack subassemblies include upper and lower jack housings sandwiching therebetween, a cross-talk shield. The terminal subassembly is substantially Z-shaped, which allows for increased space there below for signal conditioning components. The terminal module also includes a center shield and a lower shield, and an outer shield, all of which are commoned together and grounded. An outer shield substantially surrounds the entire assembly, and is commoned to the other shield members.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.