Chamfer processing method and device for plate material
US7033255B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 28, 2003 |
| Grant date | Apr 25, 2006 |
| Priority date | — |
| Expiry date | May 28, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B47/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Chamfer processing is carried out by making plate material W end faces come in contact with rotating grinding belts. The grinding surfaces of the opposing side by side grinding belts are on the centerline in the thickness direction of the plate material. The center point is considered the pivot point as seen from the plate material end faces and in distance is smaller than the thickness of the plate material. Pivot motion of the plate material is carried out in the rotating direction of grinding belts. This chamfer processing method and device enables chamfer in a small curvature radius without applying a heavy tension load on grinding belts, and performs uniform deep chamfer processing of multiple plate material simultaneously.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.