Method for forming microstructures on a substrate using a mold
US7033534B2 · kind B2 · utility
2Cited by
60References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 9, 2001 |
| Grant date | Apr 25, 2006 |
| Priority date | — |
| Expiry date | Jul 30, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2211/36
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
In a method of making a microstructured assembly, a substantially uniform coating of a curable material is formed on a substrate with the coating defining a leading edge. The coating is contacted with a mold starting at the leading edge to form in the curable material a plurality of barrier regions connected by intervening land regions. The curable material is cured and the mold is removed. Optionally, the coating includes a binder. Such a coating can optionally be debinded. In addition, the coating can be fired to form ceramic microstructures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.