Thermally conductive substrate, thermally conductive substrate manufacturing method and power module
US7033865B2 · kind B2 · utility
0Cited by
5References
5Claims
0Family size
Assignee
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Key dates
| Filing date | Aug 26, 2003 |
| Grant date | Apr 25, 2006 |
| Priority date | — |
| Expiry date | Jan 21, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09145
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
By providing an end portion of a radiation plate located on and near an end portion of an insulator sheet, to which a lead frame extends, at a position away from the end portion of the insulator sheet inside of the insulator sheet in a plane direction of the insulator sheet, it is possible to secure a creeping distance between the lead frame and the radiation plate without decreasing a lead frame area on which components can be actually mounted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.